Neopad Technologies Corporation designs, tests, and manufactures highly specialized CMP pads using proprietary nanoparticle and nanocomposite technology for the production of advance semiconductors and hard drives. Utilizing a very repeatable compression molded manufacturing process, our unique solo pad technology provides dramatically improved planarization within die and across wafer performance, lower defectivity and improved customer cost-of–ownership savings results via extended pad life and significant slurry efficiency.

The Neopad CMP pad is designed with unique “tunable” features for specific polish applications that provide a novel key process parameter to improve CMP process performance for current and advanced technologies.